WZ-A15

SMT AOI inspection is deployed in two scenarios: pre-reflow and post-reflow. Pre-reflow AOI is installed after the pick-and-place machine but before the reflow oven to inspect PCBs that have been populated with components but not yet soldered. It detects defects such as missing parts, wrong components, misalignment, reversed polarity, tombstoning, and other placement errors. By catching issues early, it prevents defective boards from entering the reflow process, identifies pick-and-place machine anomalies promptly, and avoids costly rework downstream. Post-reflow AOI is positioned at the reflow oven outlet to inspect finished PCBA assemblies. It focuses on identifying solder joint defects like cold joints, insufficient or excessive solder, bridging, and solder balls, while also verifying component appearance and placement status. The system automatically flags defective units and stores inspection data, enabling traceability via integration with MES systems. Combining pre-reflow and post-reflow AOI creates a comprehensive visual quality control defense for the entire SMT production line, replacing manual visual inspection to reduce missed detections and false judgments, minimize rework and material waste, and help enterprises improve efficiency and product quality.